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Hall ICs
DN8796MS
3 V operation Hall IC Alternating magnetic field operation
Unit: mm
Overview
The DN8796MS is a 3 V operation Hall IC which includes a Hall element, amplifier circuit, Schmidt circuit, stabilized power supply and temperature compensation circuit which are integrated on a single chip with a fine patterning technology. The magnetic input signal is outputted by being converted to high or low. We have improved the conventional circuit to realize a stable operation covering from low to high supply voltage and from low to high temperature.
2.80 +0.20 -0.30 0.650.15 1.50 +0.25 -0.05 0.650.15
0.95
1.900.20
2.90 +0.20 -0.05
1
0.95
3
2
1.10 +0.20 -0.10
* Wide operating supply voltage range (VCC = 2.7 V to 14.4 V) * Wide operating ambient temperature (-40C to +85C) * Package: Mini type (3-pin type) (1.1 mm thick: Same as a standard transistor) * Eqipped with an output pull-up resistor (typical 56 k)
0 to 0.10
Features
0.80
0.10 to 0.30 0.400.20
MINI-3D Note) The package of this product will be changed to lead-free type (MINI-3DA). See the new package dimensions section later of this datasheet.
Applications
* DC brushless motor, fan motor, rotation sensor, detection of cover open/close (example for a cellular phone), position sensor
Block Diagram
1 VCC
Constant voltage source
56 k (typ.)
Comparator Hall element Amplifier
3
Out
GND
2
Publication date: November 2002
SPC00008CJB
0.16 +0.10 -0.06
0.40 +0.10 -0.05 1.45
1
DN8796MS
Pin Descriptions
Pin No. 1 2 3 Symbol Out VCC GND Description Output pin Supply voltage pin Ground pin
Absolute Maximum Ratings
Parameter Supply voltage Symbol VCC VOUT Supply current Power dissipation Operating ambient temperature Storage temperature ICC PD Topr Tstg Rating 18 18 120 -40 to +85 -55 to +125 mA mW C C Unit V
Note) 1. Except for the operating ambient temperature and storage temperature, all ratings are for Ta = 25C. 2. The reverse insertion of this IC will cause its breakdown. 3. It will operate normally in several tens of ms after power on. 4. This IC is not suitable for car electrical equipment.
Recommended Operating Range
Parameter Supply voltage Symbol VCC Range 2.7 to 14.4 Unit V
Electrical Characteristics at Ta = 25C
Parameter Operating magnetic flux density 1 Operating magnetic flux density 2 Hysteresis width Output voltage 1 Output voltage 2 Output voltage 3 Output voltage 4 Output short-circuited current Supply current 1 Supply current 2 Symbol BH-L BL-H BW VOL1 VOL2 VOH1 VOH2 -IOS ICC1 ICC2 VCC = 3 V VCC = 3 V VCC = 3 V VCC = 14.4 V, IO = 5 mA, B = -18 mT VCC = 2.7 V, IO = 5 mA, B = -18 mT VCC = 14.4 V, IO = -20 A, B = 18 mT VCC = 2.7 V, IO = -20 A, B = 18 mT VCC = 14.4 V, B = 18 mT VCC = 2.7 V, B = 18 mT Conditions Min -18 4 12.8 1.05 Typ 8 0.07 0.07 13.3 1.55 0.27 3.4 2.5 Max 18 12 0.30 0.30 13.8 2.05 0.39 6.0 6.0 Unit mT mT mT V V V V mA mA mA
VCC = 14.4 V, B = 18 mT, VO = 0 V 0.19 1.0 1.0
Note) 1. Symbol BH-L stands for the operating magnetic flux density where its output level varies from high to low. 2. Symbol BL-H stands for the operating magnetic flux density where its output level varies from low to high. 3. The variation of operating magnetic flux density does not depend on supply voltage due to its built-in stabilized power source. (VCC should be confined to the range of 2.7 V to 14.4 V.) 4. A supply current changes by maximum 1 mA when its output level varies from high to low.
2
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DN8796MS
Technical Data
* Position of a Hall element (unit in mm) Distance from a package surface to sensor part: 0.71 mm A Hall element is placed on the shaded part in the figure.
0.5
0.5
1.2
0.5
* Magneto-electro conversion characteristics
S
Output voltage
BL-H BW
BH-L
N Applied magnetic flux density B Direction of applied magnetic field
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3
DN8796MS
Technical Data (continued)
* Output Rise Time
(V) 3
2 VCC = 3 V 1
0 0 10 t (ns)
(V) 3 10% 2 - applied magnetic field 90% 1
0 0 Output Rise Time
(V) 3
10
t (ns)
2 - applied magnetic field 1
0 0 Output Rise Time 1 t (s)
VCC = 3.0 V, Pull-Up-R. = 56 k Output Rise Time - aooliedmagnetic field (s) + aooliedmagnetic field (ns) Sample. 1 8.98 292 Sample. 2 7.72 318 Sample. 3 9.18 356 Sample. 4 8.06 280 Sample. 5 8.78 320 Average 8.74 313
4
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DN8796MS
Technical Data (continued)
* Main characterisitcs Output low voltage Ambient temperature (VCC = 2.7 V)
IO = 5 mA IO = 6 mA IO = 7 mA IO = 8 mA IO = 9 mA IO = 10 mA 0.25 0.25
Output low voltage Ambient temperature (VCC = 5.0 V)
IO = 5 mA IO = 6 mA IO = 7mA IO = 8 mA IO = 9 mA IO = 10 mA
Output Low voltage (V)
0.20 0.15 0.10 0.05 0 -50
Output Low voltage (V)
0 50 100 150
0.20 0.15 0.10 0.05 0 -50
0
50
100
150
Ambient temperature (C)
Ambient temperature (C)
Output low voltage Ambient temperature (VCC = 20 V)
IO = 5 mA IO = 6 mA IO = 7 mA IO = 8 mA IO = 9 mA IO = 10 mA 0.25
Output low voltage Supply voltage (Temp. = -50C)
IO = 5 mA IO = 6 mA IO = 7 mA IO = 8 mA IO = 9 mA IO = 10 mA 0.25
Output Low voltage (V)
Output Low voltage (V)
0.20 0.15 0.10 0.05 0 -50
0.20 0.15 0.10 0.05 0
0
50
100
150
0
5
10
15
20
Ambient temperature (C)
Supply voltage (V)
Output low voltage Supply voltage (Temp. = 25C)
IO = 5 mA IO = 6 mA IO = 7 mA IO = 8 mA IO = 9 mA IO = 10 mA 0.25
Output low voltage Supply voltage (Temp. = 150C)
IO = 5 mA IO = 6 mA IO = 7 mA IO = 8 mA IO = 9 mA IO = 10 mA 0.25
Output Low voltage (V)
0.20 0.15 0.10 0.05 0 0 5 10 15 20
Output Low voltage (V)
0.20 0.15 0.10 0.05 0 0 5 10 15 20
Supply voltage (V)
Supply voltage (V)
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5
DN8796MS
Technical Data (continued)
* Main characterisitcs (continued) Pull-up resistor Ambient temperature
IO = 2.7 V IO = 20 V 90 85
90 85
Pull-up resistor Supply voltage
Temp. = -50C Temp. = 25C Temp. = 150C
Pull-up resistor (k)
80 75 70 65 60 55 50 45 40 -50 0 50 100 150
Pull-up resistor (k)
80 75 70 65 60 55 50 45 40 0 5 10 15 20
Ambient temperature (C)
Supply voltage (V)
Supply current Ambient temperature
VCC = 2.7 V(Output = High) VCC = 2.7 V(Output = Low) VCC = 5.0 V(Output = High) VCC = 5.0 V(Output = Low) VCC = 20 V(Output = High) VCC = 20 V(Output = Low) 7
7
Supply current Supply voltage
Temp. = -50C (Output = High) Temp. = -50C(Output = Low) Temp. = 25C (Output = High) Temp. = 25C (Output = Low) Temp. = 150C (Output = High) Temp. = 150C (Output = Low)
Supply current (mA)
Supply current (mA)
6 5 4 3 2 1 0 -50 0 50 100 150
6 5 4 3 2 1 0 0 5 10 15 20
Ambient temperature (C)
Supply voltage (V)
6
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DN8796MS
Technical Data (continued)
* Main characterisitcs (DN8796MS/DN8798MS) (continued) Operating magnetic flux density Ambient temperature (VCC = 2.7 V) Operating magnetic flux density Ambient temperature (VCC = 3.0 V)
BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 15 10 5 0 -5 -10 -15 -20 -50 0 50 100 150 BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 15 10 5 0 -5 -10 -15 -20 -50 0 50 100 150
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
Ambient temperature (C)
Ambient temperature (C)
Operating magnetic flux density Ambient temperature (VCC = 20 V)
BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 15 10 5 0 -5 -10 -15 -20 -50 0 50 100 150
Operating magnetic flux density Supply voltage
BL-H (Temp. = -50C) BH-L (Temp. = -50C) BL-H (Temp. = 150C) BH-L (Temp. = 150C) 10 5 0 -5 -10 -15 -20 0 5 10 15 20
Operating magnetic flux density (mT)
Ambient temperature (C)
Operating magnetic flux density (mT)
Supply voltage (V)
Operating magnetic flux density Supply voltage
BL-H (Temp. = -50C) BH-L (Temp. = -50C) BL-H (Temp. = 150C) BH-L (Temp. = 150C) 10.0 5.0 0.0 -5.0 -10.0 -15.0 -20.0 2.2
Operating magnetic flux density (mT)
2.4
2.6
2.8
3.0
Supply voltage (V)
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DN8796MS
Technical Data (continued)
* Main characterisitcs (DN8797MS/DN8799MS) (continued) Operating magnetic flux density Ambient temperature (VCC = 2.7 V) Operating magnetic flux density Ambient temperature (VCC = 3.0 V)
BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 25 20 15 10 5 0 -50
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 25 20 15 10 5 0 -50
0
50
100
150
0
50
100
150
Ambient temperature (C)
Ambient temperature (C)
Operating magnetic flux density Ambient temperature (VCC = 20 V)
BL-H-1 BH-L-1 BL-H-2 BH-L-2 BL-H-3 BH-L-3 25 20 15 10 5 0 -50
Operating magnetic flux density Supply voltage
Operating magnetic flux density (mT)
Operating magnetic flux density (mT)
BL-H (Temp. = -50C) BH-L (Temp. = -50C) BL-H (Temp. = 125C) BH-L (Temp. = 125C) 20 18 16 14 12 10 0 5 10 15 20
0
50
100
150
Ambient temperature (C)
Supply voltage (V)
Operating magnetic flux density Supply voltage
BL-H (Temp. = -50C) BH-L (Temp. = -50C) BL-H (Temp. = 125C) BH-L (Temp. = 125C) 20 18 16 14 12 10 2.2
Operating magnetic flux density Supply voltage
BW (Temp. = -50C) BW (Temp. = 125C) 5 4 3 2 1 0 0 5 10 15 20
Operating magnetic flux density (mT)
2.4
2.6
2.8
3.0
Operating magnetic flux density (mT)
Supply voltage (V)
Supply voltage (V)
8
SPC00008CJB
DN8796MS
Caution on Use of Hall ICs
The Hall ICs are often used to detect movement. In such cases, the position of the Hall IC may be changed by exposition to shock or vibration over a long period of time, and it causes the detection level change. To prevent this, fix the package with adhesives or fix it on a dedicated case. 1. A case using an adhesive Some kinds of adhesive generate corrosive gas (such as chloric gas) during curing. This corrosive gas corrodes the aluminum on the surface of the Hall IC, and may cause a functional defect of disconnection. If Hall IC is to be sealed after installation, attention should be given to the adhesive or resin used for peripherals and substrate cleaner, as well as to the adhesive used for Hall IC installation. Please confirm the above matter to those manufacturers before using. We could not select the specified adhesive, for we find it difficult to guarantee the ingredient of each adhesive. 2. Power supply line/Power transmission line If a power supply line/power transmission line becomes longer, noise and/or oscillation may be found on the line. In this case, set the capacitor of 0.1 F to 10 F near the Hall IC to prevent it. If a voltage of 18 V or more is thought to be applied to the power supply line (flyback voltage from coil or the ignition pulse, etc.), avoid it with external components (capacitor, resistor, Zener diode, diode, surge absorbing elements, etc.). 3. On mounting of the surface mount type package (MINI-3D) When mounted on the printed circuit board, the Hall IC may be highly stressed by the warp that may occur from the soldering. This may also cause a change in the operating magnetic flux density and a deterioration of its resistance to moisture.
Wrong Correct
4. VCC and GND Do not reverse VCC and GND. If the VCC and GND pins are reversely connected, this IC will be destroyed. If the IC GND-pin voltage is set higher than other pin voltage, the IC configuration will become the same as a forward biased diode. Therefore, it will turn on at the diode forward voltage (approximately 0.7 V), and a large current will flow through the IC, ending up in its destruction. (This is common to monolithic IC.) 5. Cautions on power-on of Hall IC When a Hall IC is turned on, the position of the magnet or looseness may change the output of a Hall IC, and a pulse may be generated. Therefore, care should be given whenever the output state of a Hall IC is critical when the supply power is on. 6. On fixing a Hall IC to holder When a Hall IC is mounted on the printed circuit board with a holder and the coefficient of expansion of the holder is large, the lead wire of the Hall IC will be stretched and it may give a stress to the Hall IC. If the lead wire is stressed intensely due to the distortion of holder or board, the adhesives between the package and the lead wire may be weakened and cause a minute gap resulting in the deterioration of its resistance to moisture. Sensitivity may also be changed by this stress. 7. On using flux in soldering Choose a flux which does not include ingredients from halogen group, such as chlorine, fluorine, etc. The ingredients of halogen group may enter where the lead frame and package resin joint, causing corrosion and the disconnection of the aluminum wiring on the surface of an IC chip. 8. In case of the magnetic field of a magnet is too strong Output may be inverted when applying a magnetic flux density of 100 mT or more. Accordingly, magnetic flux density should be used within the range of 100 mT. 9. On surface treatment of mini-mold package Surface treatment is available in either smooth or dull finish. 10. On soldering of the surface mount type package Surface mounting type Hall ICs are apt to change its electrical characteristics due to the stress from soldering at mounting. Therefore, avoid the mounting by flow (dipping) and a soldering iron. Please mount it by reflow soldering abiding by its recommended conditions.
SPC00008CJB
9
DN8796MS
New Package Dimensions (Unit: mm)
* MINI-3DA (Lead-free package) (1.45)
0.40+0.10 -0.05 0.10 M 3
1.50+0.25 -0.05 1 0.95 0.95 1.900.20 2.90+0.20 -0.05 2 0.650.15
0.650.15 2.80+0.20 -0.30
1.10+0.20 -0.10
0.10
0 to 0.10
1.10+0.30 -0.10
0.400.20
0.10 to 0.30 Seating plane
10
SPC00008CJB
0.11+0.10 -0.05
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
2002 JUL

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